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DS1615X 40PT10B N1113 PESD5V0 CS00000 AM79212 T52C3V9T HE04002
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  multilayer ceramic chip capacitors 1 of 3 creation date : may 17, 2017 (gmt) c2012x6s0j106k085ac tdk item description c2012x6s0j106kt**** applications commercial grade feature general general (up to 50v) series c2012 [eia 0805] status production (not recommended for new design) size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 0.85mm 0.15mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 10f 10% rated voltage 6.3vdc temperature characteristic x6s(22%) dissipation factor (max.) 10% insulation resistance (min.) 10m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 17, 2017 (gmt) c2012x6s0j106k085ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c2012x6s0j106k085ac esr c2012x6s0j106k085ac capacitance c2012x6s0j106k085ac dc bias characteristic c2012x6s0j106k085ac temperature characteristic c2012x6s0j106k085ac(no bias) c2012x6s0j106k085ac(dc bias = 3.15v ) ripple temperature rising c2012x6s0j106k085ac(100khz) c2012x6s0j106k085ac(500khz) c2012x6s0j106k085ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 17, 2017 (gmt) c2012x6s0j106k085ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.


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